Product Specifications

WR-ZEN TP

System On-Chip

  • SoC: Xilinx Zynq series
  • CPU: Dual ARM® CortexTM-A9 MP@ 866 MHz
  • Memory:
    • 512 MB DDR3 (32-bit bus)
    • 256 Mbits Quad-SPI Flash

    • 16GB SD Card

Physical Dimension

  • Dimension: 431 mm x 44 mm x 300 mm / (1 Rack Unit)
  • Color: White (Metallic)

Environmental Conditions

  • Temperature: -10ºC ~ +50ºC
  • Humidity: 0% ~ 90% RH

Front Panel

  • Ethernet: 2x 100/1000 Base-T RJ45 (Management, NTP)
  • FMC: 1x Low-Pin count FMC slot (LPC)
    • Using HPC-FMC footprint to support extra GTP channel/clock on board

  • SFP Ports: 2x 1GbE
  • Clocks I/O: 5x SMA connectors (3.3V @50Ω):
    • 10MHz SIN OUT ref.clock (PLL)
    • CLK TTL OUT

    • PPS OUT (LVTTL)

    • PPS IN (LVTTL)

    • 10MHz IN (TTL/CMOS/ECL/clipped sine)

  • Timing: Common outputs to provide Timing

    • 2xRJ45, ToD (NMEA) RS485

    • 2xDB9, 4x configurable* xPPS/CLK

    • *xPPS/CLK outputs are divided in two groups of 4 customized PPS/CLK (1, 10, 1k-10M)Hz similar to the SMA Aux Clk.
  • LCD: Information panel for alert & network
  • Debug: USB Mini-B (ARM-UART)

Back-panel

  • Fan 2 x (1-4) Swappable fan modules

WR-ZEN TP-FL

System On-Chip

  • SoC: Xilinx Zynq series
  • CPU: Dual ARM® CortexTM-A9 MP@ 866 MHz
  • Memory:
    • 512 MB DDR3 (32-bit bus)
    • 256 Mbits Quad-SPI Flash

    • 16GB SD Card

Physical Dimension

  • Dimension: 444 mm x 43 mm x 221 mm / (1 Rack Unit)
  • Color: White (Metallic)

Environmental Conditions

  • Temperature: -10ºC ~ +50ºC
  • Humidity: 0% ~ 90% RH

Front Panel

  • Ethernet: 2x 100/1000 Base-T RJ45 (Management, NTP)
  • SFP Ports: 2x 1GbE
  • Clocks I/O: 5x SMA connectors (3.3V @50Ω):
    • 10MHz SIN OUT ref.clock (PLL)
    • CLK OUT (LVTTL)

    • PPS OUT (LVTTL)

    • PPS IN (LVTTL)

    • 10MHz IN (TTL/CMOS/ECL/clipped sine)

  • LCD: Information panel for alert & network
  • Expansion: 4x SMA coaxial connectors (3.3V/50Ω):

    • PPS OUT (LVTTL)

WR-ZEN TP-32BNC

System On-Chip

  • SoC: Xilinx Zynq series
  • CPU: Dual ARM® A9 MP@ 866 MHz
  • Memory:
    • 512 MB DDR3 (32-bit bus)
    • 256 Mbits Quad-SPI Flash

    • 16GB SD Card

Physical Dimension

  • Dimension: 428 mm x 88 mm x 220 mm / (2 Rack Units)

  • Color: White (Metallic)

Environmental Conditions

  • Temperature: -10ºC ~ +50ºC

  • Humidity: 0% ~ 90% RH

Front Panel

  • Ethernet: 2x 100/1000 Base-T RJ45 (Management, NTP)

  • SFP Ports: 2x 1GbE
  • Clocks I/O: 5x SMA connectors (3.3V @50Ω):
    • 10MHz SIN OUT ref.clock (PLL)
    • CLK OUT (LVTTL)

    • PPS OUT/IRIG-B (LVTTL)

    • PPS IN (LVTTL)

    • 10MHz IN (TTL/CMOS/ECL/clipped sine)

  • Fanout: 32 BNC configurable outputs divided in 2 groups (1.7V/50Ω):

    • A&B: 10MHz (xPPS under license) with 50Ω termination
    • C&D: xPPS, IRIG-B with selectable 50Ω termination
  • LCD: Information panel for alert & network
  • Debug: USB Mini-B (ARM-UART)